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ODU AMC® High-Density

Innovation in a compact package.

From medical technology to consumer electronics to automotive technology: the trend toward miniaturization continues. High-Density connectors provide the highest possible number of contacts in the most compact space. It gives developers new possibilities and solutions while simultaneously challenging the manufacturer. Because the connectors’ reliability and electrical and mechanical robustness must remain intact in spite of the compact size.

Features

Description

Applications

Video

  • 2 – 40 poles
  • 4 sizes
  • Watertight protection class IP 68
  • Lifetime of greater than 5,000 mating cycles
  • Break-Away for maximum safety
  • Extremely robust and stable housing with non-reflecting surface
  • Operating temperature range from -51° C (-60° F) to +125° C (+257° F)
  • Contacts for solder and PCB termination
  • Light, compact and easy to use – blind mating is also possible
  • Highspeed data technology
  • Maximum operating reliability thanks to mechanical keying and visual colour coding
  • Versatile and individually configurable: Signal, power and data possible within one connector
  • Salt spray resistance
  • 360° shielding for excellent, trouble-free data transfer
  • Connection to flex or printed circuit board solutions on the receptacle side
  • Termination to PC-boards,flex-layers or rigid-flex solutions
  • Innovative options for assembly and extrusion for the cable bend relief

With a diameter of less than 10 mm to 18.5 mm and a contact density of up to 40 contacts, the ODU AMC High-Density series proves that premium quality can also come in small packages. In addition to the High-Density signal connector, the range also includes versions for "Power" (up to 15 A) and "Data Transfer" (USB 3.0 with 5A power) in the most compact space.  

  • Smallest Dimension
  • Compact Design
  • High Contact Density
  • System Solution
  • Innovative options for assembly and extrusion for the cable bend relief
  • Quick and easy demating
  • Low space requirements for devices
  • Low force required

ODU AMC High Density

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